| Synonyme |
- Copper Thinfoil, 0.0125mm (0.0005in) thick, 99.9% (metals basis)
- Copper Thinfoil, 0.015mm (0.0006in) thick, 99.97% (metals basis)
- Copper Thinfoil, 0.01mm (0.0003in) thick, 99.8% (metals basis)
- Copper discs, 9.0^+0.127mm (0.354^+0.005in) dia x 0.8^+0.051mm (0.03^+0.002in) thick, 99.9995% (metals basis)
- Copper flake, 1-5 micron, 99.9% (metals basis)
- Copper foil (99%)
- Copper foil (99.9%)
- Copper foil (99.9985%)
- Copper foil, 0.025mm (0.001in) thick, Puratronic|r, 99.999% (metals basis)
- Copper foil, 0.025mm (0.001in) thick, annealed, coated, 99.8% (metals basis)
- Copper foil, 0.05mm (0.002in) thick, Puratronic|r, 99.9999% (metals basis)
- Copper foil, 0.05mm (0.002in) thick, annealed, 99.8% (metals basis)
- Copper foil, 0.127mm (0.005in) thick, annealed, 99.9% (metals basis)
- Copper foil, 0.127mm (0.005in) thick, annealed, 99.99+% (metals basis)
- Copper foil, 0.1mm (0.004in) thick, Puratronic|r, 99.999% (metals basis)
- Copper foil, 0.1mm (0.004in) thick, Puratronic|r, 99.9999% (metals basis)
- Copper foil, 0.254mm (0.010in) thick, 99.9% (metals basis)
- Copper foil, 0.25mm (0.01in) thick, Puratronic|r, 99.9985% (metals basis)
- Copper foil, 0.25mm (0.01in) thick, Puratronic|r, 99.9999% (metals basis)
- Copper foil, 0.25mm (0.01in) thick, annealed, 99.95% (metals basis), oxygen free
- Copper foil, 0.25mm (0.01in) thick, hard, Puratronic|r, 99.999+% (metals basis)
- Copper foil, 0.5mm (0.02in) thick, Puratronic|r, 99.998% (metals basis), Oxygen free
- Copper foil, 0.5mm (0.02in) thick, Puratronic|r, 99.9985% (metals basis)
- Copper foil, 0.5mm (0.02in) thick, Puratronic|r, 99.9999% (metals basis)
- Copper foil, 0.675mm (0.027in) thick, annealed, 99.9% (metals basis)
- Copper foil, 1.0mm (0.04in) thick, 99.99% (metals basis)
- Copper foil, 1.0mm (0.04in) thick, Puratronic|r, 99.999% (metals basis)
- Copper foil, 1.27mm (0.05in) thick, 99.9% (metals basis)
- Copper foil, 2.0mm (0.08in) thick, Puratronic|r, 99.999% (metals basis)
- Copper gauze, 20 mesh woven from 0.41mm (0.016in) dia wire
- Copper gauze, 40 mesh woven from 0.056mm (0.0022in) dia wire
- Copper gauze, 50 mesh woven from 0.23mm (0.009in) dia wire
- Copper nanoparticle (10-15nm) in acetone at 100mg/L (surfactant-free)
- Copper nanoparticle (50-70nm) in acetone at 100mg/L (surfactant-free)
- Copper nanoparticle (50-70nm) in ethylene glycol at 100mg/L (surfactant-free)
- Copper plate, 6.35mm (0.25in) thick, 99.9% (metals basis)
- Copper powder (99%)
- Copper powder (99.5%)
- Copper powder (99.999%)
- Copper powder, -100 mesh, 99% (metals basis)
- Copper powder, -100 mesh, 99.999% (metals basis)
- Copper powder, -150 mesh, 99.5% (metals basis)
- Copper powder, -22 mesh, Puratronic|r, 99.999% (metals basis)
- Copper powder, -325 mesh, 10% max +325 mesh, 99% (metals basis)
- Copper powder, -40+100 mesh, 99.5% (metals basis)
- Copper powder, -625 mesh, APS 0.50-1.5 micron, 99% (metals basis)
- Copper powder, -625 mesh, APS 2-3.50 micron, 99% (metals basis)
- Copper powder, -625 mesh, APS 3.25-4.75 micron, 99.9% (metals basis)
- Copper powder, spherical (99.9%)
- Copper powder, spherical, -100 mesh, 99.5% (metals basis)
- Copper powder, spherical, -100+325 mesh, 99.9% (metals basis)
- Copper powder, spherical, APS 10 micron, 99.9% (metals basis)
- Copper rod (99.999%)
- Copper rod, 19mm (0.8in) dia, Puratronic|r, 99.999% (metals basis)
- Copper rod, 3.18mm (0.125in) dia, random lengths, Puratronic|r, 99.999% (metals basis)
- Copper rod, 5mm (0.2in) dia, Puratronic|r, 99.999% (metals basis)
- Copper rod, 6.35mm (0.25in) dia, 99.9% (metals basis)
- Copper rod, 7mm (0.3in) dia, Puratronic|r, 99.999% (metals basis)
- Copper rod, 9.5mm (0.4in) dia, Puratronic|r, 99.999% (metals basis)
- Copper shot (99.9%)
- Copper shot (99.999%)
- Copper shot (99.9999%)
- Copper shot, 1-10mm (0.04-0.4in), 99.9% (metals basis)
- Copper shot, 13mm (0.5in) dia, 99.99% (metals basis), oxygen free
- Copper shot, 4-6mm (0.16-0.24in), Puratronic|r, 99.999% (metals basis)
- Copper shot, 8mm (0.3in) & down, ACS, 99.9+% (metals basis)
- Copper shot, 9mm (0.35in) & down, Puratronic|r, 99.9999% (metals basis)
- Copper slug, 3.175mm (0.125in) dia x 3.175mm (0.125in) length, 99.995% (metals basis)
- Copper slug, 3.175mm (0.125in) dia x 3.175mm (0.125in) length, Puratronic|r, 99.9999% (metals basis)
- Copper slug, 3.175mm (0.125in) dia x 6.35mm (0.25in) length, Puratronic|r, 99.9999% (metals basis)
- Copper slug, 6.35mm (0.25in) dia x 12.7mm (0.50in) length, 99.996% (metals basis)
- Copper slug, 6.35mm (0.25in) dia x 12.7mm (0.50in) length, Puratronic|r, 99.9999% (metals basis)
- Copper slug, 6.35mm (0.25in) dia x 6.35mm (0.25in) length, 99.99% (metals basis)
- Copper slug, 6.35mm (0.25in) dia x 6.35mm (0.25in) length, 99.996% (metals basis)
- Copper slug, 6.35mm (0.25in) dia x 6.35mm (0.25in) length, Puratronic|r, 99.9999% (metals basis)
- Copper sputtering target, 50.8mm (2.0in) dia x 6.35mm (0.250in) thick, 99.999% (metals basis)
- Copper sputtering target, 76.2mm (3.0in) dia x 3.18mm (0.125in) thick, 99.999% (metals basis)
- Copper sputtering target, 76.2mm (3.0in) dia x 6.35mm (0.250in) thick, 99.999% (metals basis)
- Copper tubing, 1.59mm (0.0626in) OD, 0.876mm (0.0345in) ID, 99.9% (metals basis)
- Copper tubing, 3.175mm (0.125in) OD, 1.5mm (0.059in) ID, 99.9% (metals basis)
- Copper turnings (99+%)
- Copper turnings, 99+% (metals basis)
- Copper wire (99.99%)
- Copper wire (99.999+%)
- Copper wire cloth, 40 mesh
- Copper wire, 0.025mm (0.001in) dia, Puratronic|r, 99.995% (metals basis)
- Copper wire, 0.127mm (0.005in) dia, 99.999% (metals basis)
- Copper wire, 0.1mm (0.004in) dia, hard, Puratronic|r, 99.9985% (metals basis)
- Copper wire, 0.25mm (0.01in) dia, Puratronic|r, 99.9985% (metals basis)
- Copper wire, 0.5mm (0.02in) dia, Puratronic|r, 99.999% (metals basis)
- Copper wire, 0.5mm (0.02in) dia, Puratronic|r, 99.999% (metals basis), Oxygen free
- Copper wire, 0.5mm (0.02in) dia, annealed, 99.9% (metals basis)
- Copper wire, 0.64mm (0.025in) dia, Puratronic|r, 99.999% (metals basis), Oxygen free
- Copper wire, 1.0mm (0.04in) dia, Puratronic|r, 99.999% (metals basis)
- Copper wire, 1.0mm (0.04in) dia, Puratronic|r, 99.999% (metals basis), Oxygen free
- Copper wire, 1.0mm (0.04in) dia, annealed, 99.9% (metals basis)
- Copper wire, 2.0mm (0.08in) dia, Puratronic|r, 99.999% (metals basis)
- Copper, powder, 99+%
- Sponge copper catalyst (Raney®-type)
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